Thick copper PCBs are characterized by structures with copper thicknesses from 105 to 400 μm. These PCBs are used for large (high) current outputs and for optimization of the thermal management. The thick copper allows large PCB-cross-sections for high current loads and encourages heat dissipation. The most common designs are multilayer or double-sided. With this PCB technology it is also possible to combine fine layout structures on the outer layers and thick copper layers in the inner layers. Performance of Thick Copper PCB: Thick copper PCB has the best elongation performance and is not limited by the processing temperature. It can be used in hot melt welding methods such as oxygen blowing at a high melting point and not brittle at low temperatures. Even in extremely corrosive atmospheric environments, copper PCB forms a strong, non-toxic passivation protective layer. Advantages of Thick Copper PCB: Thick copper PCB is widely used in various household appliances, high-t

There are many ways to solve EMI problems. Modern EMI suppression methods include: using EMI suppression coatings, selecting appropriate EMI suppression parts, and EMI simulation design. This article starts with the most basic PCB layout, discusses the role and design skills of PCB layered stack-up in controlling EMI radiation. Electricity Busbar Reasonably placing a capacitor of appropriate capacity near the power supply pin of the IC can make the output voltage of the IC jump faster. However, the problem does not end there. Due to the limited frequency response of the capacitor, this makes it impossible for the capacitor to generate the harmonic power required to cleanly drive the output of the IC over the entire frequency band. In addition, the transient voltages formed on the electricity busbar will form a voltage drop across the inductance of the decoupling path. These transient voltages are the main source of common-mode EMI interference. How should we solve these proble